Innovatier’s unique patented embedding process is setting the standards in the active RFID and powered card packaging field… And the possibilities are endless!
September 15,2006 - Why is this process superior?
- Low temperature-low pressure encapsulation process: Innovatier utilizes a “cold lamination” process to embed electronics components and power devices, at temperatures as low as 120°F. Low pressure of less than 25 psi/1.7 bar is also used, which helps to eliminate damage to batteries or
other sensitive components.
- Durability: Innovatier’s highly durable elastomeric core and proprietary reaction injected molding process can be tailored to the products’ performance requirements for optimum durability and security. It is highly resistant to thermal or flexural stress.
- Secure embedding: Innovatier’s proprietary process allows embedding materials to flow gaps as small as 0.0005”. The end result is chemical and tamper resistant, resulting in a highly durable package.
- A simple and scalable manufacturing process: Innovatier’s Reaction Injection Embedding© Technology uses a simple and friendly manufacturing process that is easily scalable. In contrast, conventional potting methods have long cycle times using expensive materials and cumbersome processes.
- Traditional lamination processes can damage components and cause unacceptable surface finishes.
- The end-result: a variety of 3 dimensional form factors: Innovatier’s patented molding method has the capability of realizing any 3-dimensional shapes. Retooling to accommodate new shapes is easy and inexpensive.
Now electronic application designers, card manufacturers, and critical component suppliers can have flexibility in component specification, and can make their most advanced designs become reality.
Innovatier – Endless Possibilities Limited Only by The Imagination™
For more information:
Lawrence J. Keim, 863-688-4548
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