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Injection Embedding vs. Lamination
Injection Embedding
Lamination
  • Short cycle single step process
  • Encapsulates fragile components
  • Low reject rates
  • Low temperature & pressure
  • Highly reproducible process
  • Significantly reduced read through
  • Portable
  • Hightly secure polymer body
  • ProTeCut™ cut resistant technology
  • Many process steps with long cycle times
  • Contact modules embedded on the surface
  • Higher device reject rate
  • Excessive temperature and pressure
  • Highly variable process
  • Significant read through
  • Poor adhesion to other plastics
  • Card can be disassembled
 
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