Innovatier’sReaction Injection Embedding®encapsulates active electronic components into unique and reliable packaging solutions.
The encapsulating material provides thermal insulation for fragile electronic components. The embedded core maintains its mechanical properties over a temperature range of -40°C to 120°C.
A simple and scalable process
Innovatier’s Reaction Injection Embedding® technology uses a simple and friendly manufacturing process that is easily scalable.
Conventional potting methods have long cycle times using expensive materials and cumbersome processes.
Traditional lamination processes can damage components and cause unacceptable surface finishes.