Innovatier’s Reaction Injection Embedding® encapsulates active electronic components into unique and reliable packaging solutions.

 

 

The encapsulating material provides thermal insulation for fragile electronic components. The embedded core maintains its mechanical properties over a temperature range of -40°C to 120°C.

 
A simple and scalable process

  • Innovatier’s Reaction Injection Embedding® technology uses a simple and friendly manufacturing process that is easily scalable.
  • Conventional potting methods have long cycle times using expensive materials and cumbersome processes.
  • Traditional lamination processes can damage components and cause unacceptable surface finishes.

 

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