Our reaction injection process allows inclusion of a number of electronic components in one simple step.
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Patented processes and other technologies are used to embed electronic components into smart cards and Radio Frequency Identification Devices (RFID), in a simple and cost effective process.
Four layers form the product. The top and bottom printed overlays encase the populated printed circuit board.
Liquid polymers are then injected at low pressure and temperature bonding the layers. As the polymers solidify, the electronic components become embedded within the thermoset material, and the layers are fused into one sturdy electronic device. The end product can take
the shape of exact-parameter credit cards, circular wrist bracelets, or any number of other shapes and sizes that your application requires.
This low-temperature and pressure injecting process allows inclusion of a number of fragile electronic components such as flexible displays, LED ’s, push-buttons, batteries, antennae, speakers, microchips and other electronic components in one simple step. |
