What Are Today’s Packaging Needs?

• A process that will embed necessary components into a plastic substrate
• A process that can produce ISO compliant and cost effective product

What Are The Attributes Of This New Process?

• Injection molding performed at low temperature and pressure thus preventing damage to fragile components
• Components are securely implanted into the cards
• Unsurpassed security: certified by NIST for compliance with FIPS 140 level 3 physical security
• Electronics may be pre-assembled and fully tested prior to implantation
• End product exhibits excellent mechanical stability and properties
• End results extremely cost effective
• Component protection and safety with Innovatier’s cut resistant technology

How Rugged Is This Process?

• High flexural performance, long life
• Secure construction prevents penetration of layers
• NCITS flexure test compliant

Is This A Patented Process?

• Innovatier has two patent issued and eight patents pending
• Through its licensing agreement with CARDXX, innovatier has the exclusive worldwide right to use CARDXX’s patented RAMP technology to manufacture financial transaction cards. CARDXX currently has six patents granted and several pending