Low-temperature and low-pressure technology
Innovatier’s patented manufacturing process can overmold components at 50°C and less than 25 psi (1.7 Bar).

Innovatier’s “cold” process does not utilize high temperature to activate a bond of the core layer to the overlays, which helps eliminate damage to sensitive electronics.

Secure embedding
This proprietary process allows embedding materials to flow gaps as small as 0.0005”.

Highly durable elastomeric core
Innovatier’s proprietary formulations can be tailored to the product’s performance requirements, for optimum durability and security.

Process strengths:
• Low viscosities
• Minimal injection forces
• Low shrinkage
• Rugged and durable construction

vs. Conventional methods:
• Battery and electronic components are compromised by heat and pressure used in lamination
• Use of adhesive fillers is cost ineffective and is not conducive to high-speed manufacturing
• Lower efficiency rates